MIJING 30g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

Features:

• 138°C lead-free low-temperature solder paste, a low-temperature lead-free solder paste customized for high-end motherboard repair
• Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store
• Low Melting Point /High Density/High Resistance Strong Activity/Strong Welding Force
• Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution
• Meet the maintenance needs of motherboards for Huawei and Apple high-end machines